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  1. CLR 1020 / CLH 6021

    Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

  2. CLR 1026 / CLH 6021

    Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

  3. CLR 1180 / CLH 6520

    Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520

  4. CLR 1205 / CLH 6770

    Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

  5. CLR 1710 / CLH 6710

    Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710

  6. CLR 1946 / CLH 6500

    Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500

  7. CLS 9611

    A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611

  8. CLS 9616

    Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616

  9. XPD 1401 / CLI 4182

    Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182

  10. XRD 1018 / XHD 1019

    1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019

  11. XRD 1575 / XH 61418

    2:1 machine dispense adhesive. Bonding abrasive wheels and disks. A two component epoxy system suitable for potting, casting and adhesive applications. Product gels quickly and has good thermal cycling endurance. Material is filled with non-abrasive fillers making it suitable for machine dispensing. XRD 1575 / XH6 1418

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